Theory of Operation
The SCANSPECTION AOI inspection process is based on comparison of PCBs
under test with a known good board with all devices placed correctly. The
setup process involves storing the images of a correctly assembled, good
board. The inspection process compares the images captured from the board
under test with the stored images of the known good board.
In the real world there are three issues that must be addressed regarding
theory of operation:
1. There are appearance variations on good boards. This means all boards
that are considered good do not all look the same. Certain variations on the
board’s appearance do not constitute defects. The system needs to be able
to ignore many areas of the board.
2. In order to inspect all areas of the board, the amount of detail that the vision
system has to extract to detect a small defect is so great that the inspection
process would be very slow.
3. The purpose of the inspection is to identify which devices (or components)
on the board are defective so that a repair can be done. It would be better if
the inspection system associated defects with devices.
The SCANSPECTION AOI’s inspection process is device or component
oriented. The setup process begins by placing a known good board into the
machine. The user defines the board size and positions of the alignment
marks. Device data of each device is then entered either interactively or
automatically extracted from the board’s CAD data. The system learns the
appearance of all the devices. This process is called Template Training. The
system maintains a database of the templates of all the good devices. In
addition to the device’s template, other device data such as device ID, device
name, device location and device size, are also stored in the database.
Usually the setup process needs to be fine tuned with several known good
boards. This allows alternative devices templates to be learned and
inspection parameters to be adjusted.
After setup, the board inspection process can begin. The process starts with
locating the alignment marks. By measuring the positions of the alignment
marks, the system compensates for board placement error, both translational
and rotational. The system then inspects each device in sequence comparing
templates for each and every device as well as performing other visual
measurements. After the entire board is inspected, including all trained
components, the system compiles the inspection results and produces a
report to the user.
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